SK Hynix Announces 72-layer TLC-3D-NAND-flash-chip

SK Hynix has according to own statements developed the world’s first TLC-3D NAND flash chip, the 72 layer consists of . It has a capacity of 256 GB and 32 GByte can represent. It has overtaken SK Hynix not only his Japanese rival Toshiba, but also the South Korean rivals Samsung .

 3D NAND Flash (image: SK Hynix) Samsung currently produces its 3D-NAND-Speicher with 64 positions. Toshiba wants to convert its production soon to 64 layers. More layers mean not only a higher capacity per chip, but also a smaller footprint for more storage in electronic devices.

SK Hynix changes according to own statements 48 layers directly to 72 locations. The storage capacity of NAND chips thereby increases 50 percent. The read and write speed will increase by 20 percent. Also speaks of companies by improving the production rate by 30 percent.

in the second half of 2016 SK Hynix began with the delivery of 3D NAND Flash with 36 positions and a capacity of 128 GB per chip. The production of 256-Gbit chips with 48 positions started in November of last year. Switching to 72 locations have you managed well within six months and it skipped 64 chips of layers of. The new chips come also in smartphones and solid state drives for use.

Gartner assumes that the market for NAND flash devices will reach a volume of 46.5 billion dollars this year. 2021 industry revenues should rise to $56.5 billion. The proportion of 3D-NAND-Chips to increase also by 18.8 percent last year to 43.4 per cent this year. 2018, the 3D will overtake the currently dominant 2D-NAND-Flash-Chips and reach 66.2 percent.

worldwide SK Hynix is currently the fifth-largest supplier of NAND Flash. That could be changing, should prevail in the bidding competition for the chips parte Toshiba’s. An another prospective buyer to be the Apple supplier Foxconn, as the Wall Street Journal reported. He is currently offer $27 billion for Toshiba’s chip business.

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[withmaterialfromChoMu-Hyun ZDNet.com ]

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